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LF Hi-Grade # 3592-35 No Residue FluxHI-GRADE 3592-35 is a non-halide, no residue flux specifically developed for wave soldering, mixed technology and through hole electronic assemblies. This formulation provides greater heat stability required for the increased temperatures uses in lead free wave soldering processes. HI-GRADE 3592-35 is formulated to provide a wide process window with excellent solderability, superior hole fill, and reduced solder balls on all surface finishes. This product can be used with Tin/Copper, Tin/Silver/Copper, and Tin/Lead alloys. Use with lead free and Tin/Lead alloy. IPC flux alloys. Excellent solderability on all board finishes. Superior hole fill. Reduces solder balls.
LF Hi-Grade # 1081 Halide Free Water Soluble FluxHI-GRADE #1081 Flux is a halide-free, organic acid activated water soluble flux for wave soldering. Free of chloride, fluoride, bromide and polyglycols, HI-Grade #1081 reduces or eliminates effluent treatment and provides complete cleaning in water to low ionic levels while leaving a surface which has high surface insulation resistance (SIR). Mild activity. Cleans to low ionic levels. Halide free, polyglycol free. Reduces or eliminates effluent treatment.
LF ST-639 Low Solid FluxEIE St 639LF is a low solid, halogen-free no-clean flux that is designed specifically for use in the electronic industry to improve effectiveness in the wave soldering of conventional and SMT circuit boards assemblies. This formula is suitable for lead-free alloys (SnCu and SnAgCu) and leaded SnPb solder. Boards are cosmetically clean when exit soldered-wave and the post-soldering residue is non-conductive, non-corrosive and need not be removed. This formula is designed to yield a better aesthetic cleanliness edge compared to most other no-clean fluxes suitable for lead-free alloys.
LF VOC Free Hi-Grade # 1075-EXR-44 FluxHI-GRADE 1075-EXR-44 is a non-halide, synthetic resin flux specifically developed for lead-free wave soldering of surface mount, mixed technology and through-hole electronic assemblies. HI-GRADE 1075-EXR-44 is a water based, non-flammable formulation eliminating special storage requirements, and reducing VOC emissions dramatically. The 1075-EXR-44 is formulated for use with lead-free alloys to reduce solder balls and produce better solderability on difficult to solder assemblies.
LF VOC Free ST-809 No Clean FluxEIE ST-809 is a VOC-Free, Low solids, halide-free organic no-clean formulation designed for wavesoldering conventional and SMT boards assemblies and is suited for rosin preservative coated bared copper-circuitry, OSP , Tin-plated and HASL printed circuit boards type. This formula is free from VOC (volatile organic compounds) with a vapour pressure higher than 0.1mm Hg @ 20 C - a guideline for VOC solvents. EIE ST-809 is formulated to maximize and enhanced solderability as priority with minimal post-soldering residue which is non-conductive, non-corrosive and does not need to be removed. This flux is classified as ORLO per IPC J-STD-004.
LF VOC Free ST-904-S No Clean FluxEIE ST 904-S is a Low VOC, Low solids, halide-free organic no-clean formulation designed for wavesoldering conventional and SMT boards assemblies. This formula is designed to provide the highest activity possible with combination of proprietary organics activators mixture, enhancing excellent wetting and top-side through-hole fill, even on OSP coated bare copper hoards. With Low VOC solvent system, formula 904-S evaporative characteristics will reduce preheating time and splattering tendency, hence low solderball occurrence frequency. 904-S is formulated to maximize and enhanced solderability as priority with minimal post-soldering residue which is non-conductive, non-corrosive and does not need to be removed.
Non-LF Hi-Grade # 3324 Soldering FluxHi-Grade #3324, a completely organic flux containing non-evaporating vehicles, is suitable for all conventional tin-lead alloys, as well as low temperature alloys. It incorporates a unique fluxing ingredient and offers an exceptionally high degree of activity in the soldering and tinning temperatures. Hi-Grade #3324 Soldering Flux was developed specifically for tinning copper wires. It has many other uses, such as, armature soldering, printed circuits plated with tin-nickel, tin or tin-nickel-plated plugs and others. In soldering applications where inorganic fluxes are TOO CORROSIVE and rosin fluxes TOO INACTIVE. This flux is ideally suited. If used on other electronic assemblies, every attempt should be made to remove flux residue.
Non-LF Hi-Grade # 3549-3 HF No Clean FluxHI-GRADE 3549-3 HF are specially formulated low solids flux designed for wave soldering where the solder cleaning operations are to be eliminated. This flux contains a small amount of resin which enhances the wetting properties. HI-GRADE 3549-3 HF is activated by multi-component, synergetic fluxing system, which improves solderability. Any remaining residues after soldering are considered non-corrosive and do not interfere with ATE testing. Meets Bellcore specification TR-NWT-000078. Meets IPC J-STD-004 specification for flux type LO. Eliminates the need for cleaning. Reduces solder ball formation. Compatible with conformal coatings without cleaning. Completely non-halide.
Non-LF Hi-Grade # 3590-T No Residue FluxHI-GRADE #3590-T NO-RESIDUE FLUX is a specially formulated low solids, nonhalide, rosin/resin-free flux designed for soldering where the solder cleaning operations are to be eliminated. This flux contains very effective flux activators, which result in excellent solderability and reduced defects. Meets Bellcore Specification TR-NWT-000078. Eliminates the need for cleaning. Excellent wetting and reduced defects. Compatible with conformal coatings without cleaning.
Non-LF Hi Grade # 1095 NF Water Soluable FluxHI-GRADE #1095-NF is a low solids neutral pH flux, halide activated for wave soldering through-hole, mixed technology and surface mount assemblies. HI-GRADE #1095-NF FLUX is biodegradable and cleans readily in water to low ionic levels while leaving a surface which has a high surface insulation resistance (SIR). The activators in HI-GRADE #1095-NF provide excellent solder wetting on Nickel, Kovar, Alloy 42 and Copper surfaces. It can be use for wave or drag soldering operations and for component lead and frame tinning. HI-GRADE #1095-NF has a neutral pH which limits the need for effluent control while easy cleaning in water eliminates the cost and environmental concerns of solvent cleaning.
Non-LF 3118 ph5.5 Aqua FluxEIE 3118 is a near neutral pH 5.5 organic halide-activated acid water-soluble flux specifically designed to improve productivity and to meet or exceeds ionic contamination cleanliness level specified by MIL-P-28809 requirement. This formula is specifically tailored to enhance good wetting for OSP treated bared copper PC boards when most Neutral pH fluxes will not perform effectively. The flux is also suited for SMOBC boards. EIE 3118 has no offensive odour and does not fume excessively during wave-soldering. The post-soldering residue is minimal and very soluble in water. This formulation does not generate excessive foaming problems during post-washing operation, commonly encountered with others commercially available neutral pH flux.